Synthesis of copper foils with high strength and high conductivity by pulse reverse electrodeposition
B. V. Sarada, M. Ramakrishna, Tata Narasinga Rao and G. Sundararajan
Pulse electrodeposition, with appropriate pulse parameters and deposition conditions is being used to develop porosity free nanocrystalline copper foils with high strength and high conductivity. Nanocrystalline copper shows improved strength, hardness, ductility at high temperatures, wear and corrosion-resistance while presence of twin boundaries minimizes the scattering of conducting electrons when compared to conventional grain boundaries, thus retaining the electrical conductivity at high strength. Such material has potential application in high density circuit boards, radio communication devices, etc.
Pulse Electrodeposition of nanostructured platinum on porous carbon substrates
B. V. Sarada, Rajalakshmi (CFCT), Tata Narasinga Rao and G. Sundararajan
Pulse electrodeposition and pulse reverse electrodeposition methods are demonstrated to be attractive techniques for deposition platinum on porous carbon electrodes. The electrodeposited platinum can be used as catalyst for several applications including fuel cell electrodes and biosensors. The performance of the catalyst layer is optimized by controlling the pulse parameters such as the peak current density, duty cycle and the total charge density. These parameters control the nucleation rate and platinum loading. The nanostructure morphology and size can also be tailored.
Nanosilver-candle filter technology has been successfully transferred to a company and the product is in the market with the brand name of PURITECH.
